Guide Acoustical Imaging (Volume 24)

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Acoustic imaging of reservoir structure from a horizontal well

ATT pt. CAA1 pt. DET2 pt. DET2 de. DED1 de.

EPA1 en. EPB1 en. CAA1 en. ATT de.

A failure distribution plot shows a normal distribution pattern, where corner joints have the lowest reliability and are more likely to fail first. A strong agreement between AMI monitoring test data and FE prediction was observed, demonstrating the feasibility of through lifetime monitoring of solder joints using AMI.

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Findings — At defective bumps, the formation of a crack causes a larger acoustic impedance mismatch which provides a stronger ultrasound reflection. Please note you might not have access to this content. You may be able to access this content by login via Shibboleth, Open Athens or with your Emerald account. If you would like to contact us about accessing this content, click the button and fill out the form.